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2 Pack 10g (20g in Total) HY910 0.975W/m-k Thermal Conductive Glue, High-Performance Thermal Plaster, Silicone Viscous Adhesive Cooling Compound, Heatsink Glue for LED GPU MOSFET 3D Printer IC Chipset
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Description
Description
Brand: Bymugo
Features:
- High Thermal Conductivity - With a thermal conductivity rate of 0.975W/m-K, this thermal conductive glue helps disperse heat effectively from MOSFETs, LEDs, ICs, GPU chipsets, and other electronic components that require direct bonding. It is suitable for all heatsinks without a fixed clip, and can be used for a wide range of applications.
- Safe and Non-Electrical Conductive - This thermal adhesive is non-electrical conductive, safe, and non-toxic, making it safe for both users and electronic components. It is odorless, moisture-resistant, and non-swelling, ensuring that it does not damage the substrate over time. Important: it is important to note that this thermal glue should not be used between the CPU and heatsink.
- Strong Adhesion - This thermal plaster features strong adhesion properties that allow it to bond with most metals and non-metals, ensuring a reliable and long-lasting connection. The adhesion and tensile strength is 2.1（MPA）, making it a high-performance option that delivers excellent results.
- Quick Drying Time - This thermal adhesive cures quickly upon contact with air, with a drying time of approximately 30 minutes at 25℃. This makes it easy and convenient to apply, with minimal downtime required.
- Wide Service Temperature Range - With a service temperature range of -60~250 degrees Celsius, this thermal adhesive is suitable for use in a wide range of industries and applications. It has good thermal conductivity and stability, and is ideal for use in electrical appliances, instruments, and other industries that require effective heat dissipation.
Details: 2 Pack 10g (20g in Total) HY910 0.975W/m-k Thermal Conductive Glue, High-Performance Thermal Plaster, Silicone Viscous Adhesive Cooling Compound, Heatsink Glue for LED GPU MOSFET 3D Printer IC Chipset
Specifications:
Material: Silicone viscous adhesive
Thermal Conductivity: >0.975 W/m-k
Weight: 10g per pack, 20g in total
Color: White
Application: MOSFET, LED, heatsinks, North-south bridge, video card, chipset, electrical appliances, instruments, 3D printers and all electronic components that require direct bonding
Operating Temperature: -60°C to 250°C
Storage Temperature: 10°C to 30°C
Shelf-life: 6 months
Features:
The 2 Pack 10g (20g in Total) HY910 0.975W/m-k Thermal Conductive Glue is a high-performance thermal plaster that is designed to provide excellent thermal conductivity and adhesion for electronic components. It is ideal for use with MOSFET, LED, heatsinks, North-south bridge, video card, chipset, electrical appliances, instruments, 3D printers and all electronic components that require direct bonding.
This thermal glue has a thermal conductivity rating of >0.975 W/m-k and is capable of dissipating heat effectively, ensuring that your device operates efficiently and prolongs its lifespan. It has a wide service temperature range of -60°C to 250°C, making it suitable for use in a wide range of environments.
The package contains 2 tubes of 10g each, totaling 20g of thermal glue. It has a white color and is easy to apply with its silicone viscous adhesive texture. Once opened, it should be used within 24 hours to ensure optimal performance. It has a strength of connected buildings of 55 lb and is ideal for all heatsinks without fixed clip thermal paste.
Overall, the 2 Pack 10g (20g in Total) HY910 0.975W/m-k Thermal Conductive Glue is an excellent choice for anyone looking to enhance the cooling performance of their electronic components, ensuring optimal functionality an
EAN: 0728872780492
Part Number: BMGUS05-HY910Jiao-20g
model number: BMGUS05-HY910Jiao-20g
